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State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results

Hangzhou Freqcontrol Electronic Technology Ltd.
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    Buy cheap State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results from wholesalers
     
    Buy cheap State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results from wholesalers
    • Buy cheap State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results from wholesalers

    State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results

    Ask Lasest Price
    Brand Name : CQTGROUP
    Model Number : Chip Foundry Services
    Certification : ISO:9001, ISO:14001
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 10000 pcs/Month
    Delivery Time : 1-4 weeks
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    State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results

    State-of-the-Art Piezoelectric Wafer Fabrication for MEMS and SAW Devices Advanced Processing Capabilities for Results


    We specialize in providing comprehensive chip foundry services, catering to clients who require high-quality wafer processing and fabrication. By simply providing design schematics and specifications, we deliver tailored solutions that meet your exact needs. Our extensive range of wafers includes Lithium Niobate (LiNbO), Lithium Tantalate (LiTaO), Single Crystal Quartz, Fused Silica Glass, Borosilicate Glass (BF33), Soda-Lime Glass, Silicon Wafers, and Sapphire, ensuring versatility for diverse applications.


    Advanced Wafer Materials Portfolio‌
    Our expertise spans industry-standard and exotic substrates:

    • Lithium Niobate (LiNbO₃, 4"-6" wafers)
    • Lithium Tantalate (LiTaO₃, Z-cut/Y-cut)
    • Single Crystal Quartz (AT-cut/SC-cut)
    • Fused Silica (Corning 7980 equivalent)
    • Borosilicate Glass (BF33/Schott Borofloat®)
    • Silicon (100/111 orientation, 200mm max)
    • Sapphire (C-plane/R-plane, 2"–8")

    ‌Core Fabrication Technologies‌

    1. ‌Lithography‌

      • Electron Beam Lithography (EBL, 10nm resolution)
      • Stepper Lithography (i-line, 365nm)
      • Proximity Mask Aligner (5μm alignment accuracy)
    2. ‌Etching‌

      • ICP-RIE (SiO₂/Si etch rate 500nm/min)
      • DRIE (Aspect ratio 30:1, Bosch process)
      • Ion Beam Etching (Angular uniformity <±2°)
    3. ‌Thin-Film Deposition‌

      • ALD (Al₂O₃/HfO₂, <1nm uniformity)
      • PECVD (SiNₓ/SiO₂, stress-controlled)
      • Magnetron Sputtering (Au/Pt/Ti, 5nm–1μm)
    4. ‌Wafer Bonding‌

      • Anodic Bonding (Glass-to-Si, 400°C/1kV)
      • Eutectic Bonding (Au-Si, 363°C)
      • Adhesive Bonding (BCB/SU-8, <5μm warpage)

    ‌Supporting Process Infrastructure‌

    • Precision Grinding (TTV <2μm)
    • CMP Polishing (Ra <0.5nm)
    • Laser Dicing (50μm kerf width)
    • 3D Metrology (White-light interferometry)
    Quality State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results for sale
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